Boards & Modules

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By: Intermec     Published Date: Jun 20, 2013
Nearly all the transportation and distribution companies in a market are governed by the similar labor laws, pay the same fuel prices and share the same roads. So why are some much more successful than others? Winning T&L companies don’t rely on cyclical business conditions to be successful. They can be profitable in any business conditions because they are differentiated, either in the services they offer customers or in their underlying business processes.
Tags : transportation, logistics technology, business practices, boards & modules, electromechanical & mechanical, optoelectonics & displays, packaging and interconnects
     Intermec
By: Mentor Graphics     Published Date: Jun 04, 2010
The focus of this paper is a combined electrical, thermal and optical characterization of power LED assemblies. Thermal management play important role in case of power LEDs, necessitating both physical measurements and simulation.
Tags : mentor graphics, electrical, thermal, optical characterization, power led assemblies, junction temperature, electronic test and measurement, boards & modules, embedded systems and networking, electromechanical & mechanical, optoelectonics & displays
     Mentor Graphics
By: Ramtron     Published Date: Nov 11, 2009
Today's technological innovation demands high performance coupled with low environmental impact. These dual requirements are driving components of the semiconductor industry which informs many global businesses and consumer lives.
Tags : f-ram, bbsram, random access memory, ram, novram, ecopack, electronics, semiconductor, memory, ramtron, system on a chip, electronic test and measurement, embedded design, boards & modules, embedded systems and networking, integrated circuits and semiconductors
     Ramtron
By: Mentor Graphics     Published Date: Sep 11, 2009
"As the number of enhancements to various Hardware Description Languages (HDLs) has increased over the past year, so too has the complexity of determining which language is best for a particular design. Many designers and organizations are contemplating whether they should switch from one HDL to another. This paper compares the technical characteristics of three, general-purpose HDLs.
Tags : comparison of vhdl, verilog and systemverilog, mentor graphics, hardware description languages (hdls), vhdl (ieee-std 1076), verilog (ieee-std 1364), ieee standard, accellera, analog communications, digital signal processing, electronic design automation, system on a chip, electronic test and measurement, embedded design, boards & modules, embedded systems and networking, electromechanical & mechanical, optoelectonics & displays, packaging and interconnects, passive & discrete components
     Mentor Graphics
By: Mentor Graphics     Published Date: Sep 04, 2009
This paper looks at the issues, materials and current processes being researched to create this integrated Opto-Electronic Circuit Board by European, Japanese and North American organizations.
Tags : mentor graphics, high density interconnect (hdi), high speed applications, opto-electronics, photonics, pcbs, opto-electronic circuit board, eobc-optofoil, univ. of ulm, fraunhafer inst, daimler-chrysler, siemens, truemode, terahertz, polyguide, dupont, topcat, nist, goodyear, jiep
     Mentor Graphics
By: TechInsights     Published Date: Sep 01, 2009
Join us at ESC Boston, September 21-24 at the Hynes Convention Center, in Boston, MA. Expo registration is FREE, and advanced registration pricing is still available for conference packages.
Tags : embedded systems, conference, boston, esc boston, build your own embedded system, atom, windows embedded, classes, tutorials, wired, wireless, programmable logic, system integration, debugging, verification, dsp, multimedia programming, design team management, security, multi-core
     TechInsights
By: Mentor Graphics     Published Date: Apr 03, 2009
A powerful signal integrity analysis tool must be flexibility, easy to use and integrated into an existing EDA framework and design flow. In addition, it is important for the tool to be accurate enough. This report reviews a validation study for the Mentor Graphics HyperLynx 8.0 PI tool to establish confidence in using it for power integrity analysis.
Tags : mentor graphics, pdn simulation, eda framework, mentor hyperlynx 8.0 pi, integrity analysis, virtual prototypes, esr, capacitor, power distribution network, vrm, voltage regulator module, signal, smas, analog models, backward crosstalk, capacitive crosstalk, controlling crosstalk, correct emc problems, correct emi problems, cross talk
     Mentor Graphics
By: Mentor Graphics     Published Date: Apr 03, 2009
For advanced signaling over high-loss channels, designs today are using equalization and several new measurement methods to evaluate the performance of the link. Both simulation and measurement tools support equalization and the new measurement methods, but correlation of results throughout the design flow is unclear. In this paper a high performance equalizing serial data link is measured and the performance is compared to that predicted by simulation. Then, the differences between simulation and measurements are discussed as well as methods to correlate the two.
Tags : mentor graphics, equalized serial data links, design flow, high loss channels, tektronix, pcb, bit error rate, ber, ieee, serdes, simulation, system configuration, mentor graphics hyperlynx, simplified symmetric trapezoidal input, duty cycle distortion, ber contours, electronics, analog models, backward crosstalk, capacitive crosstalk
     Mentor Graphics
By: Mentor Graphics     Published Date: Apr 03, 2009
High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.
Tags : power integrity effects, mentor graphics, high density interconnect, hdi, chip pinouts, perforation, multilayer or build-up multilayer, bum, sequential build-up technologies, sbu, buried via holes, bvhs, dielectric materials, photosensitive, laser drilling, plasma drilling, microvia, plated through-holes, pths, power distribution network
     Mentor Graphics
By: Mentor Graphics     Published Date: Apr 03, 2009
The success of any consumer electronic device depends to a large extent on the appeal of the user interface (UI) and how easy the device is to use. Studies show that good cosmetic design can encourage users to explore the full range of features and often engenders the perception that a product is easier to use. So if the benefits of a great looking, easy-to-use UI are so clear, why are so many products still falling short of customer expectations? The solution lies in taking a fresh new approach a consumer electronic device UI plays. By identifying common UI functionality and implementing it in a reusable and customizable way, we can make it far easier for embedded engineers to deliver visually engaging and easy-to-use consumer electronic products.
Tags : inflexion platform ui, user interface, consumer electronic device, mentor graphics, ui functionality, media player, mobile phone, tv set-top box, inflexion platform ui, pc-based ui designer tool, embedded component, presentation layer, integration api, xml-based ui template, ui perspective, embedded gui, embedded gui design, embedded gui development, embedded gui prototype, embedded ui
     Mentor Graphics
By: Mentor Graphics     Published Date: Apr 03, 2009
Moving to C++ presents opportunities for higher programmer productivity. The requirements of embedded systems, however, demand that the adoption of C++ be carefully measured for the performance impact of run-time costs present in C++, but not in C. This talk suggests strategies for developers who are starting their acquaintance with C++.
Tags : c++, coding, developer, programming, programmer, mentor graphics, run-time costs, embedded systems, ansi/iso c[, risc, first principle, cost evaluation, declaration, evaluation principle, initialized static consts, arbitrary placement of declarations, overloading, function in-lining, multiple inheritance, run-time type identification
     Mentor Graphics
By: Intermec     Published Date: Aug 09, 2012
Tablet computing is one of the fastest growing categories of consumer electronics, led by the Apple iPad. This buzz is leading many businesses to explore new uses for tablet computers, and some devices are finding their way into evaluation trials on forklifts and other vehicle applications in the distribution center. This white paper compares ruggedized enterprise tablets to purpose-built vehicle mount computers, and addresses mounting, survivability, power, compatibility, and cost considerations between the two product categories.
Tags : intermec, tablet, computing, ipad, computers, compatibility, wireless application software, wireless hardware, application integration, application performance management, ebusiness, sales automation, server virtualization, workforce management, business intelligence, content integration, document management, records management, spend management, employee monitoring software
     Intermec
By: Kingston     Published Date: Feb 15, 2011
Learn how to balance the positive and negative effects of memory utilization in virtual infrastructures to better handle system workload and priority--while improving server utilization
Tags : virtualization, memory overcommitment, memory performance, memory reclamation, vmware, memory utilization, consolidation ratios, server memory, server utilization, memory ballooning, vmkernal swapping, capacity planning, vmware esx 4.0, active directory, bandwidth management, convergence, distributed computing, ethernet networking, fibre channel, gigabit networking
     Kingston
By: VersaLogic Corp.     Published Date: Nov 03, 2010
How the SUMIT interconnect standard is designed to meet the evolving needs of embedded systems.
Tags : embedded, single board computer, sumit, pci express, pcie, form factor, embedded design, boards & modules, embedded systems and networking
     VersaLogic Corp.
By: Nexlogic Technologies, Inc.     Published Date: Oct 21, 2010
Defining EU Directive - RoHS, WEEE Pb-Free, a basic tutorial of requirements, materials, and questions to ask EMS providers and contract manufacturers about Pb-free qualifications and costs
Tags : pb-free, rohs, weee, pcb design, pcb fabrication, pcb assembly, pcb procurement, electronic test and measurement, embedded design, boards & modules, embedded systems and networking
     Nexlogic Technologies, Inc.
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